Background exploitation KEV catalog

CVE-2022-22071

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial…

CheckOps priority index

4.6/10 Patch within 7 days

Severity8.4

Probability0.0

Exploitation2/5

Severity = CVSS. Probability = EPSS (FIRST). Exploitation = public signals: KEV, EUVD, ransomware, EPSS above 10 %, no account required.

EPSS · today 0.41% higher than 35.3% of CVEs

CVSS 3.1 8.4 AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:

Exploited for 1,064 days 05 Dec 2023

CISA due date 26 Dec 2023 for US federal agencies

Exploitation probability EPSS · FIRST

EPSS probability (%)Percentile among all CVEs

Exploitation signals 2 / 5

KEV catalog (CISA)05 Dec 2023
Exploited in EUVD (ENISA)05 Dec 2023
Used by ransomwareno
EPSS above 10 %0.41%
No account, over the networkno

What to do

Fix

Apply the vendor’s fix as soon as it is available.

CISA guidance: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

Meanwhile

Take the service off the internet or restrict access to it, watch the logs and look for signs of compromise.

Manufacturers (CRA)

Exploited vulnerability in your product: early warning to ENISA within 24 h, then notification within 72 h (Article 14 of the Cyber Resilience Act). The CRA explained

Description ENISA EUVD

Affected products

Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & MusicMultiple Chipsets

Affected versions

APQ8053, AR8031, AR8035, CSRA6620, CSRA6640, MDM9150, MSM8953, QCA6174A, QCA6390, QCA6391, QCA6426, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCM2290, QCM4290, QCM6490, QCS2290, QCS405, QCS410, QCS4290, QCS610, QCS6490, QRB5165, QRB5165M, QRB5165N, Qualcomm215, SA6155P, SA8155P, SA8195P, SD439, SD460, SD480, SD662, SD680, SD690 5G, SD695, SD750G, SD765, SD765G, SD768G, SD778G, SD780G, SD855, SD865 5G, SD870, SD888 5G, SDX12, SDX55, SDX55M, SDX65, SDXR2 5G, SM4125, SM7250P, SM7325P, WCD9326, WCD9335, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3615, WCN3660B, WCN3680B, WCN3910, WCN3950, WCN3980, WCN3988, WCN3991, WCN3998, WCN3999, WCN6740, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WCN7850, WCN7851, WSA8810, WSA8815, WSA8830, WSA8835

Weaknesses (CWE)

CWE-416

Open source packages OSV

Affected libraries according to OSV, with fixed versions.

Timeline

14 Jun 2022
Published
05 Dec 2023
Exploitation reported (ENISA)
05 Dec 2023
Added to the KEV catalog
26 Dec 2023
CISA remediation due date

References

Other exploited vulnerabilities from the same vendor

CVE-2026-21385Qualcomm Multiple Chipsets Memory Corruption Vulnerability
4.4 · Background exploitation
CVE-2025-27038Qualcomm Multiple Chipsets Use-After-Free Vulnerability
4.8 · Background exploitation
CVE-2025-21480Qualcomm Multiple Chipsets Incorrect Authorization Vulnerability
4.7 · Background exploitation
CVE-2025-21479Qualcomm Multiple Chipsets Incorrect Authorization Vulnerability
4.7 · Background exploitation
CVE-2024-43047Qualcomm Multiple Chipsets Use-After-Free Vulnerability
4.3 · Background exploitation
CVE-2023-33107Qualcomm Multiple Chipsets Integer Overflow Vulnerability
4.6 · Background exploitation