Background exploitation KEV catalog
CVE-2026-21385

Qualcomm Multiple Chipsets Memory Corruption Vulnerability

Memory corruption while using alignments for memory allocation.

CheckOps priority index
4.4/10 Patch within 7 days
Severity7.8
Probability0.1
Exploitation2/5

Severity = CVSS. Probability = EPSS (FIRST). Exploitation = public signals: KEV, EUVD, ransomware, EPSS above 10 %, no account required.

EPSS · today 1.3% higher than 70.8% of CVEs
CVSS 3.1 7.8 AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:
Exploited for 245 days 03 Mar 2026
CISA due date 24 Mar 2026 for US federal agencies

Exploitation probability EPSS · FIRST

05010025 Sep05 Oct15 Oct24 Oct02 Nov
EPSS probability (%)Percentile among all CVEs

Exploitation signals 2 / 5

  • KEV catalog (CISA)03 Mar 2026
  • Exploited in EUVD (ENISA)03 Mar 2026
  • Used by ransomwareno
  • EPSS above 10 %1.3%
  • No account, over the networkno

What to do

Fix

Apply the vendor’s fix as soon as it is available.

CISA guidance: Apply mitigations per vendor instructions, follow applicable BOD 22-01 guidance for cloud services, or discontinue use of the product if mitigations are unavailable.

Meanwhile

Take the service off the internet or restrict access to it, watch the logs and look for signs of compromise.

Manufacturers (CRA)

Exploited vulnerability in your product: early warning to ENISA within 24 h, then notification within 72 h (Article 14 of the Cyber Resilience Act). The CRA explained

Affected products

SnapdragonMultiple Chipsets
Affected versions
  • QCS4490
  • Snapdragon 429 Mobile Platform
  • WCD9375
  • FastConnect 6800
  • Snapdragon 625 Mobile Platform
  • Qualcomm Video Collaboration VC5 Platform
  • SA8295P
  • Snapdragon 865 5G Mobile Platform
  • 5G Fixed Wireless Access Platform
  • WCD9385
  • IQ6 Series Platform
  • MDM9628
Weaknesses (CWE)

Open source packages OSV

Affected libraries according to OSV, with fixed versions.

Timeline

  1. Published

  2. Exploitation reported (ENISA)

  3. Added to the KEV catalog

  4. CISA remediation due date

References

Other exploited vulnerabilities from the same vendor

  • CVE-2025-27038Qualcomm Multiple Chipsets Use-After-Free Vulnerability
    4.8 · Background exploitation
  • CVE-2025-21480Qualcomm Multiple Chipsets Incorrect Authorization Vulnerability
    4.7 · Background exploitation
  • CVE-2025-21479Qualcomm Multiple Chipsets Incorrect Authorization Vulnerability
    4.7 · Background exploitation
  • CVE-2024-43047Qualcomm Multiple Chipsets Use-After-Free Vulnerability
    4.3 · Background exploitation
  • CVE-2023-33107Qualcomm Multiple Chipsets Integer Overflow Vulnerability
    4.6 · Background exploitation
  • CVE-2023-33106Qualcomm Multiple Chipsets Use of Out-of-Range Pointer Offset Vulnerability
    4.6 · Background exploitation

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Sources: CISA KEV · ENISA EUVD · FIRST EPSS · OSV. Public data aggregated by CheckOps, updated automatically. Source texts remain the property of their authors. All exploited vulnerabilities